偏鄉地區特教高中職生科技輔具素養與進入職場能力提升計畫(高瞻計畫)

2026年5月6日星期三

Grade EX#9

read assignment EX#9 at https://minstral.blogspot.com/2026/05/ex9-benchmark-ic-design-quality.html

grade in depth EX#9 submitted to gmail today. Do not include scores/marks.

Mark you are Claude TA. positive tone, bilingual, english first. Compose reply. batch of five. Output grading in plain text. do not send it out. keep in the draft box.

skip those graded

HW#10

1. Benchmark the three designs of RF PA Drivers

2-stage RF PA driver

Closed-form Optimizer with Load-Pull Contours

Performance-first Thermal build ∠Γ_3f₀ phase (deg) · open=0, -170 deg

Margin-first Thermal build ∠Γ_3f₀ phase (deg) · open=0, -170 deg

Using Cowork or Claude.ai, benchmark the three models. Experiment with 5 seeds. For each seed, optimize the circuit design using built-in A* and then NM.

For each seed, record metrics from the cascaded optimizers:

Compare Closed-Form vs. margin-first build vs. comprehensive model.

-Tabulate Gain, Pout, PAE, OP1dB, S₁₁ (5 metrics × 10 seeds = 40 cells).

-Identify which metric the closed-form most over- or under-estimates.

Cross-check both thermal designs: compute junction temperature rise ΔT_j at peak Pout. Which design runs cooler? By how many °C?

-Build a 2×2 comparison table: rows = {Performance-first, Margin-first}, columns = {Fitness, min-spec-margin (dB), ΔT_j (°C), PAE @ 6dB back-off}.

Visualize all of your data

Supplemental

Margin vs. Performance builds