Grade EX# (Variant for post-grading)

 designated homework assignment EX#11

1. look up the matched homework assignment published within two weeks in 

https://minstral.blogspot.com/

2. grade in depth submitted to gmail within 2 weeks.

3. Do not include scores/marks.

4. Mark you are Claude TA. positive tone, bilingual, english first.

5. Compose reply. Output grading in plain text. do not send it out. keep in the draft box.

6. batch of 15

7 grade most recent submissions which have not yet been graded by Claude TA
(skip those with most recent submission already graded by Claude TA. Do grade if the most recent submission only receives grading from Prof.)

EX#13 navigation

  課堂練習 

Deadline:  Saturday at 23:59 (one more week)

Send all the share links to  me chang212@gmail.com by email with subject EX#13 [your id, your name]

1. 

參考Voronoi navigation app

製作以下場景的導航（可使用前一次作業的3d model）

task 1: make an entrance/exit. make the auto-navigation route deliberately exit through this gate (e.g., a waypoint placed just outside on the brick path) and go to central woods as destination.

task 2: set FPV (first-person view) and maintain horizontal view angle

task 3: show Voronoi Waypoints for navigation

2. Generate fractals from text. You may choose two themes to present. The following are some examples and the prompts that generate them.

artifact (share)

artifact (share)

artifact (share)

artifact(share)

artifact, fly thru woods

Trees are fractals

 

HW#12 PnR for Apple C1 PLL and RISC Core CPU

  1. Build a model of Apple C1 ADPLL — 7.0 GHz (spec) with A* and NM Version, NM cross checked by MNA,  

2. Enhance the Apple C1 PLL model with DTC by building an Optimizer with MNA-powered trajectory. share, DTC-Solver

You may refer to schematic, architecture and timing, DTC-TDC Timing (share)

Apple C1 ADPLL — 7.0 GHz  (C1 is N4P)

Head-to-head

3. Macro Routing for a RISC core CPU

 baseline macro 32, metal layers 3, die 550 × 600 μm

add timing

add CTS

add std cells

add logistic prob of wins

Bit sliced macro 28, metal layers 9, die 690 × 750 μm