HW#10

  1. Benchmark the three designs of RF PA Drivers

2-stage RF PA driver 

Closed-form Optimizer with Load-Pull Contours 

Performance-first Thermal build  ∠Γ_3f₀ phase (deg) · open=0, -170 deg

Margin-first Thermal build ∠Γ_3f₀ phase (deg) · open=0, -170 deg

Using Cowork or Claude.ai, benchmark the three models. Experiment with 5 seeds. For each seed, optimize the circuit design using built-in A* and then NM. 

For each seed, record metrics from the cascaded optimizers: 

Compare Closed-Form vs. margin-first build vs. comprehensive model. 

-Tabulate Gain, Pout, PAE, OP1dB, S₁₁ (5 metrics × 10 seeds = 40 cells).

-Identify which metric the closed-form most over- or under-estimates.

Cross-check both thermal designs: compute junction temperature rise ΔT_j at peak Pout. Which design runs cooler? By how many °C?

-Build a 2×2 comparison table: rows = {Performance-first, Margin-first}, columns = {Fitness, min-spec-margin (dB), ΔT_j (°C), PAE @ 6dB back-off}.

Visualize all of your data

Supplemental

Margin vs. Performance builds

design choices